Electronic component mounting machine including a film thickness gauge

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United States of America Patent

PATENT NO 9961818
SERIAL NO

15102941

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting head moves to a position above the storage section and lowers the film thickness gage to cause the film thickness gage to come into contact with the flux film. In the film thickness gage, the measurement sections form measurement marks corresponding to the film thickness in the flux film. The electronic component mounting machine images the measurement marks using a mark camera, and determines the film thickness of the flux film which is actually formed based on imaging data.

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Patent Owner(s)

Patent OwnerAddress
FUJI CORPORATIONCHIRYU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagata, Yoshinori Anjo, JP 44 515

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