Security mesh and method of making
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United States of America Patent
Stats
-
May 1, 2018
Issued Date -
N/A
app pub date -
Sep 21, 2016
filing date -
Dec 15, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.
First Claim
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Family
International Classification(s)
- 2016 Application Filing Year
- C23C Class
- 3247 Applications Filed
- 2111 Patents Issued To-Date
- 65.02 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C23C Class
- 0 % this patent is cited more than
- 7 Age
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|---|---|---|---|---|
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