Solder joint material and method of manufacturing the same, soldering member and solar cell module

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United States of America Patent

PATENT NO 9960289
SERIAL NO

14497655

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Abstract

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A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

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Patent Owner(s)

Patent OwnerAddress
HITACHI METALS LTD2-70 KONAN 1-CHOME MINATO-KU TOKYO 108-0075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujito, Keisuke Mito, JP 22 46
Kuroda, Hiromitsu Hitachi, JP 58 240
Sagawa, Hideyuki Naka-gun, JP 33 135
Tsuji, Takayuki Kitaibaraki, JP 70 1364

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