Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method
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United States of America Patent
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May 1, 2018
Issued Date -
N/A
app pub date -
Sep 17, 2013
filing date -
Sep 18, 2012
priority date (Note) -
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Abstract
To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.
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International Classification(s)
- B23B:TURNING; BORING
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- G02F:DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF ....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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