Micro-hoses for integrated circuit and device level cooling
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United States of America Patent
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May 1, 2018
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app pub date -
Jun 3, 2016
filing date -
Jun 4, 2015
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Abstract
A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
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