Bandgap reference apparatus and methods

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United States of America Patent

PATENT NO 9958895
SERIAL NO

13004617

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Abstract

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Structure and methods for a compensated bandgap reference circuit. A first integrated circuit die having a first bandgap reference circuit with a non-zero temperature coefficient; and having a first output reference signal is provided, a second integrated circuit die having a second bandgap reference circuit with a non-zero temperature coefficient that is of opposite polarity from the temperature coefficient of the first bandgap reference circuit, and having a second output reference signal is provided; an adder circuit disposed on at least one of the first and second integrated circuit dies combines the first and second output reference signals, and outputs a combined reference signal; and connectors for connecting the first and second output signals to the adder circuit are provided. Methods are disclosed for pairing integrated circuit dies with bandgap reference circuits and coupling the dies to form temperature compensated signals.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chih-Chia Taipei, TW 30 243
Peng, Mark Shane Hsin-Chu, TW 25 881

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