Vacuum socket and semiconductor testing system including the same
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United States of America Patent
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May 1, 2018
Issued Date -
N/A
app pub date -
Jun 20, 2016
filing date -
Jul 8, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.
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