Constant stress pin tip for testing integrated circuit chips
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United States of America Patent
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May 1, 2018
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app pub date -
Jul 6, 2016
filing date -
Jul 7, 2015
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Abstract
A structure and method of constructing a tip for a contact pin used in IC test housing for testing integrated circuits. As the pin is deflected when the device under test (DUT) pad engaged the tip of the pin, the tip pressure normally increases as the elastomers biasing the pin are engaged. This causes uneven pressure on the tip and will create debris and reduce tip life. By making the surface of the tip wider in the X or Y direction the surface pressure is reduced during the pin contact cycle. It is also possible to reduce tip pressure by having the top surface change in the Z axis so that recedes downwardly along its travel path, the pressure is reduced.
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