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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MITSUBISHI MATERIALS CORPORATION	TOKYO
MITSUBISHI SHINDOH CO LTD	TOKYO TOKYO METROPOLIS

International Classification(s)

• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
• C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
• C22C:ALLOYS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hokazono, Takashi	Osaka, JP	8	23
Nakasato, Yosuke	Osaka, JP	19	53
Oishi, Keiichiro	Osaka, JP	78	383
Takasaki, Michio	Osaka, JP	6	14

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 1, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 1, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 01, 2018	US,9957589,B2   US9957589B2	GRANTED PATENT AS SECOND PUBLICATION
November 05, 2015	US,20150318068,A1   US20150318068A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9957589

Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material

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