Method and device for thermocompression bonding

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United States of America Patent

PATENT NO 9956722
SERIAL NO

14245566

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Abstract

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There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.

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Patent Owner(s)

Patent OwnerAddress
STRATEC CONSUMABLES GMBHSONYSTRASSE 20 ANIF 5081

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsukasa, Murota Shizuoka, JP 1 0

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