Semiconductor package
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United States of America Patent
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Apr 24, 2018
Issued Date -
N/A
app pub date -
Jul 11, 2016
filing date -
Mar 22, 2016
priority date (Note) -
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Abstract
A semiconductor package may include a DRAM chip mounted on a substrate; an interposer stacked over the DRAM chip and including redistribution structures; a nonvolatile memory chip stacked over the interposer; a memory controller chip mounted on the substrate, and including a control circuit for controlling the nonvolatile memory chip and first pads and second pads electrically coupled to the control circuit; first conductive coupling members configured to electrically couple bonding pads of the nonvolatile memory chip to the redistribution structures; second conductive coupling members configured to electrically couple the redistribution structures to the first pads; and third conductive coupling members configured to electrically couple the second pads to the substrate.
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