Semiconductor device and semiconductor package
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United States of America Patent
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Apr 24, 2018
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N/A
app pub date -
Apr 4, 2016
filing date -
Nov 13, 2015
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Abstract
A semiconductor device may include a first metal line; a second metal line; a first insulating layer formed between the first metal line and the second metal line; a first driving unit coupled to the first metal line, the first driving unit being suitable for driving the first metal line in response to first data; and a second driving unit coupled to the second metal line, the second driving unit being suitable for driving the second metal line in response to second data obtained by inverting and delaying the first data.
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