Work pieces and methods of laser drilling through holes in substrates using an exit sacrificial cover layer
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United States of America Patent
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Apr 24, 2018
Issued Date -
N/A
app pub date -
Apr 26, 2016
filing date -
Apr 28, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.
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International Classification(s)
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- B44C:PRODUCING DECORATIVE EFFECTS
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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