Printed wiring board, semiconductor package and method for manufacturing printed wiring board
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United States of America Patent
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Apr 24, 2018
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N/A
app pub date -
Apr 30, 2015
filing date -
Apr 30, 2014
priority date (Note) -
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Abstract
A printed wiring board includes a core laminate including insulating layers and conductor layers, a first build-up layer formed on first surface of the laminate and including first interlayer resin and conductor layers, and a second build-up layer formed on second surface of the core laminate on the opposite side and including second interlayer resin and conductor layers. The conductor layers in the laminate include first and second conductor layers such that the first conductor layer is embedded in one of the insulating layers forming the first surface of the laminate and has an exposed surface exposed from the insulating layer and that the second conductor layer is formed on one of the insulating layers forming the second surface of the laminate, and the first interlayer resin layer has thickness greater than thickness of the second interlayer resin layer.
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