Electronic component mounting apparatus and electronic component mounting method
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United States of America Patent
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Apr 17, 2018
Issued Date -
N/A
app pub date -
Feb 25, 2015
filing date -
Feb 26, 2014
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Abstract
An electronic component mounting apparatus includes an electronic component supply device for supplying an electronic component, a head including a head main body and a head camera unit, and a control device. The head main body includes nozzles, a nozzle drive unit for driving the nozzles and a head support body for supporting the nozzles and the nozzle drive unit. The head camera unit is fixed to the head support body and has head cameras corresponding to the nozzles respectively for photographing electronic components. The head drives the nozzles to hold the electronic components, transfers the electronic components from the electronic component supply device to the substrate and mounts the electronic components onto the substrate. The control device synthesizes images photographed by the head cameras to generate an image with fields of the head cameras connected together, and determines a process based on the synthesized image synthesized.
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