Resin composite electrolytic copper foil, copper clad laminate and printed wiring board
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United States of America Patent
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Apr 17, 2018
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N/A
app pub date -
Aug 19, 2016
filing date -
Jul 24, 2009
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Abstract
The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.
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