Hybrid chip comprising hybrid connector
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United States of America Patent
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Apr 17, 2018
Grant Date -
Jan 26, 2017
app pub date -
Jul 15, 2016
filing date -
Jul 24, 2015
priority date (Note) -
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Abstract
An integrated circuit (IC), a method of testing the IC, and a method of manufacturing the IC are provided. The IC includes analog circuitry, digital circuitry, at least one first connector, and a switching unit operatively coupled with the at least one first connector and configured to, if a first signal is received, couple the analog circuitry and the at least one first connector, and, if a second signal is received, couple the digital circuitry and the at least one first connector.
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