Magnetic assembly packaging process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 17, 2018
Grant Date -
Dec 24, 2015
app pub date -
Jun 23, 2014
filing date -
Jun 23, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A magnetic assembly packaging process is described. The magnetic assembly packaging process comprises the steps of setting a first substrate and a second substrate in a jig; performing electrical connection of the magnetic component to the first substrate and the second substrate; overlaying the enclosure over the first substrate and the second substrate; overturning the preformed magnetic assembly; and injecting an insulation paste layer between the first substrate and the second substrate. Accordingly, the magnetic assembly packaging process can effectively minimize the manufacturing cost and the volume of the magnetic element through reducing the overall volume of the substrate.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully