Photolithographic mask

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United States of America Patent

PATENT NO 9946155
SERIAL NO

15793579

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Abstract

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A method is provided for fabricating a photolithographic mask. The method includes providing a transparent substrate; and forming an opaque layer on the transparent substrate. The method also includes writing layout patterns with at least one sub-resolution assistant feature with non-uniform size along a longitudinal direction to increase an adhesion force between the sub-resolution assistant feature with non-uniform size along the longitudinal direction and the transparent substrate in the opaque layer. Further, the method include cleaning residual matters generated by writing the layout patterns in the opaque layer. Further, the method also includes spin-drying the transparent substrate with the layout patterns and the sub-resolution assistant feature with non-uniform size along the longitudinal direction.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION201203 18 ZHANGJIANG ROAD SHANGHAI PUDONG NEW AREA MUNICIPAL DISTRICT SHANGHAI CITY 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Boxiu Shanghai, CN 14 38
Huang, Yi Shanghai, CN 995 3138

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