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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
FORD GLOBAL TECHNOLOGIES LLC	ONE AMERICAN ROAD FL4 DEARBORN MI 48126

International Classification(s)

• B60K:ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF ....
• B60W:CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT....

• 2015 Application Filing Year
• B60K Class
• 2427 Applications Filed
• 1969 Patents Issued To-Date
• 81.13 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Lear, Christopher Alan	Dearborn, US	22	148
# of filed Patents : 22 Total Citations : 148
Nefcy, Bernard D	Novi, US	109	942
# of filed Patents : 109 Total Citations : 942
Yamazaki, Mark Steven	Canton, US	137	1177
# of filed Patents : 137 Total Citations : 1177

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Patent Citation Ranking

• 0 Citation Count
• B60K Class

• 0 % this patent is cited more than
• 7 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Oct 17, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 17, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 17, 2018	US,9944289,B2   US9944289B2	GRANTED PATENT AS SECOND PUBLICATION
May 11, 2017	US,20170129493,A1   US20170129493A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9615444

Manufacturing of a heat sink by wave soldering

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Abstract

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An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.

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Description

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Claims

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Legal Events

 

• FEPP2024
• AS2022
• MAFP2020
• I2017
• STCF2017
• P2016
• F2015
• PD2013

Date	Code	Event	Description
Nov 25, 2024	FEPP	FEE PAYMENT PROCEDURE	free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
May 30, 2022	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:STMICROELECTRONICS S.R.L.;REEL/FRAME:060301/0355 Owner name: STMICROELECTRONICS INTERNATIONAL N.V., SWITZERLAND Effective Date: May 30, 2022
Sep 19, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Apr 04, 2017	I	Issuance
Mar 15, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Mar 17, 2016	P	Published
Nov 24, 2015	F	Filing
Apr 05, 2013	PD	Priority Date