Scalable thermal solution for high frequency panel array applications or other applications
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United States of America Patent
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Apr 10, 2018
Issued Date -
N/A
app pub date -
Oct 5, 2015
filing date -
Oct 5, 2015
priority date (Note) -
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Abstract
An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
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