Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Apr 10, 2018
Issued Date -
N/A
app pub date -
Apr 25, 2017
filing date -
Jun 16, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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TEXAS INSTRUMENTS INCORPORATED | DALLAS TEXAS 75251 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Beddingfield, Stanley Craig | Austin, US | 15 | 430 |
# of filed Patents : 15 Total Citations : 430 | |||
Chen, Jie | Denton, US | 1059 | 5911 |
# of filed Patents : 1059 Total Citations : 5911 | |||
Gupta, Chittranjan Mohan | Richardson, US | 9 | 61 |
# of filed Patents : 9 Total Citations : 61 | |||
Mi, Minhong | Newton Center, US | 19 | 1469 |
# of filed Patents : 19 Total Citations : 1469 | |||
Morrison, Gary Paul | Garland, US | 5 | 82 |
# of filed Patents : 5 Total Citations : 82 | |||
Murugan, Rajen Manicon | Garland, US | 59 | 328 |
# of filed Patents : 59 Total Citations : 328 | |||
Rhyner, Kenneth Robert | Rockwall, US | 5 | 61 |
# of filed Patents : 5 Total Citations : 61 | |||
Trombley, Django Earl | Dallas, US | 5 | 108 |
# of filed Patents : 5 Total Citations : 108 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 10, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 10, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Nov 05, 2007 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Oct 07, 2007 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Oct 07, 2007 |
Oct 07, 2007 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Apr 25, 2007 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Oct 07, 2003 | I | Issuance | |
May 30, 2002 | P | Published | |
Jan 07, 2002 | F | Filing | |
Jan 11, 2000 | PD | Priority Date |

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