Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

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United States of America Patent

PATENT NO 9941228
SERIAL NO

15497024

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Abstract

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A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

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Patent Owner(s)

Patent OwnerAddress
TEXAS INSTRUMENTS INCORPORATEDDALLAS TEXAS 75251

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beddingfield, Stanley Craig Austin, US 15 430
Chen, Jie Denton, US 1059 5911
Gupta, Chittranjan Mohan Richardson, US 9 61
Mi, Minhong Newton Center, US 19 1469
Morrison, Gary Paul Garland, US 5 82
Murugan, Rajen Manicon Garland, US 59 328
Rhyner, Kenneth Robert Rockwall, US 5 61
Trombley, Django Earl Dallas, US 5 108

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3689997611243481558461392216162801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500900095001000010500

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