Devices and methods for detecting counterfeit semiconductor devices
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United States of America Patent
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Apr 10, 2018
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N/A
app pub date -
Aug 7, 2015
filing date -
Aug 8, 2014
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Abstract
Techniques for providing a tamper mechanism for semiconductor devices are disclosed herein. The techniques include, for example, providing at least one die and at least one strain gauge, orienting the at least one strain gauge to the die, forming an encapsulated semiconductor device by encapsulating the die and each strain gauge within a mold compound to maintain respective orientation, and measuring an initial strain value for the at least one strain gauge after forming the encapsulated semiconductor device.
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