Method and apparatus for transfer lamination
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United States of America Patent
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Apr 10, 2018
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N/A
app pub date -
Mar 2, 2011
filing date -
Mar 2, 2010
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Abstract
An embodiment of the inventive method of transfer lamination involves metallizing a first side of a film and then bonding the metallized first side to a substrate. Then a coating is applied to a second side of the film after it has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.
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