Method and device for cooling soldered printed circuit boards
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United States of America Patent
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Apr 3, 2018
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app pub date -
Oct 22, 2012
filing date -
Oct 25, 2011
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Abstract
Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. The method according to the invention and the device (1) according to the invention advantageously permit highly efficient cooling of printed circuit board modules after the soldering process. The cooling gas may advantageously be used for inerting the soldering system (2) after extraction from the cooling zone (15).
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