Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method
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United States of America Patent
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Apr 3, 2018
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N/A
app pub date -
Aug 9, 2016
filing date -
Aug 18, 2015
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Abstract
A bonding arrangement comprising a silicone-base adhesive composition is suited for temporarily bonding a wafer to a support for wafer processing. The bonding arrangement includes a first temporary bond layer of non-silicone thermoplastic resin, and a second temporary bond layer of thermosetting silicone polymer and/or a third temporary bond layer of thermosetting siloxane-modified polymer. The second and/or third bond layer contains an antistatic agent.
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