Contact mechanic tests using stylus alignment to probe material properties
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United States of America Patent
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Apr 3, 2018
Grant Date -
Dec 22, 2016
app pub date -
Sep 2, 2016
filing date -
Jun 21, 2013
priority date (Note) -
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Abstract
An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.
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