Process for fabricating inductive heated solder cartridge

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United States of America Patent

PATENT NO 9931705
SERIAL NO

14032616

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Abstract

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A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.

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Patent Owner(s)

Patent OwnerAddress
HAKKO CORPJAPAN'S OSAKA OSAKA CITY LANGSU DISTRICT SALT GRASS 2 CHOME 4 NO 5

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyazaki, Mitsuhiko Osaka, JP 37 734
Nemoto, Hisao Osaka, JP 24 86

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