Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layer
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United States of America Patent
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Mar 27, 2018
Grant Date -
Jul 9, 2015
app pub date -
Dec 25, 2012
filing date -
Jul 6, 2012
priority date (Note) -
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Abstract
Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less.
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