Piezoelectric device package and method of fabricating the same

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United States of America Patent

PATENT NO 9929337
SERIAL NO

14294910

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Abstract

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A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cha, Sang Yeob Suwon-Si, KR 11 14
Lee, Jong Pil Suwon-Si, KR 39 281
Lee, Soon Bum Suwon-Si, KR 3 5
Yasuda, Katsushi Suwon-Si, KR 6 10

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