Copper-alloy capping layers for metallization in touch-panel displays
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United States of America Patent
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Mar 27, 2018
Issued Date -
N/A
app pub date -
Jun 5, 2014
filing date -
Jun 6, 2013
priority date (Note) -
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Abstract
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
- C21D:MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS....
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