Package including a plurality of stacked semiconductor devices an interposer and interface connections
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United States of America Patent
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Mar 27, 2018
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app pub date -
Dec 9, 2017
filing date -
Jun 14, 2015
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Abstract
A package can include first, second, and third dynamic random access memory (DRAM) semiconductor devices having first, second and third through vias, respectively, and stacked above an interposer. First, second, and third interface connections can be formed between the DRAM semiconductor devices. A first wiring of the interposer can be connected at a central portion of a first external connection that receives a first power supply potential. A second wiring of the interposer can be connected to a second external connection that receives a first data signal.
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