Resonant circuit including bump pads
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United States of America Patent
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Mar 27, 2018
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N/A
app pub date -
Jun 8, 2015
filing date -
Jun 8, 2015
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Abstract
Aspects of this disclosure relate to a first die includes an LC resonant circuit including a first capacitive element, such as a capacitor or a varactor, and an inductive element. The LC resonant circuit is configured to generate a signal having a frequency of oscillation. The first die includes bump pads electrically coupled to both ends of the first capacitive element. A second die can be flip chip mounted on the first die. Bumps can electrically connect a second capacitive element of the second die in parallel with the first capacitive element of the first die. This can increase the Q factor of the LC resonant circuit.
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