Defect inspection and repairing method and associated system and non-transitory computer readable medium
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United States of America Patent
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Mar 27, 2018
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N/A
app pub date -
Jul 14, 2016
filing date -
Jul 14, 2016
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Abstract
A defect inspection and repairing method is disclosed. The method includes: providing a wafer including a semiconductor chip disposed on a surface of the wafer; disposing a layer over the semiconductor chip; obtaining a scanned image of the disposed layer; performing an image analysis upon the scanned image to obtain a defect information; and generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer. Associated system and non-transitory computer-readable medium are also disclosed.
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