Multi-chip device with temperature control element for temperature calibration
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United States of America Patent
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Mar 27, 2018
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app pub date -
Feb 27, 2012
filing date -
Feb 27, 2012
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Abstract
A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.
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