Sensor unit including a decoupling structure and manufacturing method therefor
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United States of America Patent
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Mar 27, 2018
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app pub date -
Feb 5, 2015
filing date -
Feb 18, 2014
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Abstract
A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.
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