Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer

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United States of America Patent

PATENT NO 9924601
SERIAL NO

14653274

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Abstract

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A method for the at least portion-wise and adhesive metallization of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallized, within an area to be metallized that is enclosed by one or more limiting lines, by molding a tool that is microstructured in accordance with the regions to be metallized within a molding area.

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Patent Owner(s)

Patent OwnerAddress
LPKF LASER & ELECTRONICS AGOSTERIEDE 7 GARBSEN 30827

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haumann, Eugen Seelze, DE 1 8
Krueger, Robin Alexander Hannover, DE 6 129
Ostholt, Roman Isernhagen, DE 30 149
Roesener, Bernd Porta Westfalica, DE 3 19

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