Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structure
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United States of America Patent
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Mar 20, 2018
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Feb 20, 2014
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Aug 23, 2011
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Abstract
To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average.
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