Three-dimensional laminated circuit board, electronic device, information processing system, and information network system
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United States of America Patent
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Mar 20, 2018
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app pub date -
Aug 18, 2016
filing date -
Aug 18, 2016
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Abstract
Aiming at providing a three-dimensional laminated circuit board which can be confirmed, in an easy and exact manner, to be an authentic product having been manufactured and packaged honestly; and at providing an electronic device, an information processing system, and an information network system using the same, disclosed is a three-dimensional laminated circuit board that includes a substrate, interconnects, and an authentication pattern; the interconnects being provided in the thickness direction of the substrate; wherein the authentication pattern is provided on the substrate, and is characterized by material, shape, layout, structure or size discriminable from those of the interconnects and the substrate.
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