Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
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United States of America Patent
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Mar 20, 2018
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app pub date -
Jan 10, 2017
filing date -
Sep 17, 2013
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Abstract
Disclosed embodiments relate to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said electronic unit and a front end contact region for electrically contacting said interconnect structure by said further electronic component. A ground plane layer is electrically insulated from said pairs of signal leads, wherein each pair of signal leads has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit, and wherein in a region adjacent to said terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to one pair of signal leads and separated from a respective neighboring clearance.
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