Structures and methods for testing printable integrated circuits
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United States of America Patent
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Mar 20, 2018
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app pub date -
Aug 20, 2015
filing date -
Aug 26, 2010
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Abstract
A substrate includes an anchor area physically secured to a surface of the substrate and at least one printable electronic component. The at least one printable electronic component includes an active layer having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers. The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.
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