Processing of a direct-bandgap chip after bonding to a silicon photonic device

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United States of America Patent

PATENT NO 9923105
SERIAL NO

14509975

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Abstract

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A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.

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Patent Owner(s)

Patent OwnerAddress
SKORPIOS TECHNOLOGIES INC7401 SNAPROLL NE ALBUQUERQUE NM 87109

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Creazzo, Timothy Albuquerque, US 31 498
Dallesasse, John Geneva, US 48 1848
Krasulick, Stephen B Albuquerque, US 77 2002
Marchena, Elton Albuquerque, US 25 503
Mizrahi, Amit Albuquerque, US 37 451
Spann, John Y Albuquerque, US 11 221

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