Detachable package structure
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United States of America Patent
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Mar 20, 2018
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N/A
app pub date -
May 20, 2015
filing date -
Apr 16, 2012
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Abstract
A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
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