Multilevel template assisted wafer bonding
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United States of America Patent
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Mar 20, 2018
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app pub date -
Sep 23, 2015
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Dec 8, 2010
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Abstract
Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.
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