Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
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United States of America Patent
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Mar 20, 2018
Issued Date -
N/A
app pub date -
Sep 6, 2016
filing date -
Jul 22, 2015
priority date (Note) -
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Abstract
The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers. At least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.
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