Package for die-bridge capacitor
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United States of America Patent
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Mar 20, 2018
Grant Date -
Mar 8, 2018
app pub date -
Sep 7, 2016
filing date -
Sep 7, 2016
priority date (Note) -
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Abstract
In some examples, a device comprises a first leadframe segment, a second leadframe segment, and a first transistor, wherein the first transistor is electrically connected to the first leadframe segment. The device further comprises a second transistor, wherein the second transistor is electrically connected to the second leadframe segment. The device further comprises a conductive element, wherein the conductive element is electrically connected to the first transistor and the second transistor. The device further comprises a capacitor, wherein a first end of the capacitor is electrically connected to the first leadframe segment and a second end of the capacitor is electrically connected to the second leadframe segment.
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