Functionalized interface structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 20, 2018
Issued Date -
N/A
app pub date -
Sep 21, 2016
filing date -
Oct 2, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully