Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device

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United States of America Patent

PATENT NO 9922901
SERIAL NO

15521426

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.

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Patent Owner(s)

Patent OwnerAddress
DEXERIALS CORPORATIONTOKYO 141-0032

International Classification(s)

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  • 2015 Application Filing Year
  • H01L Class
  • 25498 Applications Filed
  • 22451 Patents Issued To-Date
  • 88.06 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aramaki, Keisuke Tokyo, JP 47 231
Daimon, Masahide Tokyo, JP 7 56
Kanaya, Hiroki Tokyo, JP 16 50

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Patent Citation Ranking

  • 1 Citation Count
  • H01L Class
  • 23.71 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3689997611243481558461392216162801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500900095001000010500

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