Semiconductor package with multiple molding routing layers and a method of manufacturing the same
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United States of America Patent
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Mar 20, 2018
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N/A
app pub date -
Nov 9, 2016
filing date -
Nov 10, 2015
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Abstract
Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple molding routing layers in a plated and etched copper terminal semiconductor package by using a laser to activate areas of each molding compound layer of the semiconductor package. Each compound filler in the molding compound layer has a metal interior and an insulating outermost shell. The activated molding compound areas in the molding compound layer become metallized in an electroless plating solution to build conductive paths on the molding compound surface, while properties of non-activated molding compound areas are not changed.
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