Drying apparatus for use in a lithography system
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United States of America Patent
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Mar 20, 2018
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app pub date -
Aug 20, 2014
filing date -
Aug 23, 2013
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Abstract
The invention relates to a drying apparatus for use in a lithography system for drying at least part of a surface on a first side of a planar target, such as a wafer. The apparatus has a drying device for eliminating liquid or droplets thereof from the first side of the planar target. The drying device has a first slit and a second slit arranged in close proximity of the target. A gap is present between the target and the drying device. Pressurized gas may be supplied via the first slit into the gap. The liquid may be discharged from the target by means of the pressurized gas through the second slit. The first and the second slit are configured to enable the pressurized gas to flow along the first side of the planar target substantially parallel to the planar target.
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